There are two main mechanisms that one of which is the avalanche breakdown, so-call intrinsic type, and the other is the filament heating transport leading to the destructive breakdown exist in the breakdown process. 在本模型中,整个击穿过程主要包含两个机构,一个是本征型的雪崩击穿,另一个是引起膜的破坏性击穿的丝状热传递。
This paper study the delay of destructive breakdown and its mechanism on SiO2 films by TCE treatment. 本文对三氯乙烯(TCE)氧化推迟SiO2膜的破坏性击穿及其机理进行了研究。
Without any restoration measure afterwards, a destructive breakdown would occur in the insulation system, and even we would encounter a large range of power outage. 如果不采取相应的修复措施,很有可能导致设备绝缘击穿,甚至引起大范围的停电。